Micron, the leading American memory chip manufacturer, announced its latest solutions at MWC 2024. It’s the company’s most compact UFS 4.0 package yet, standing at just 9 x 13 millimeters. It still offers 1 TB capacity and excellent performance – 4300 MB/s sequential read and 4000 MB/s sequential write speeds.
The main reason Micron came up with the smaller solution was feedback from smartphone OEMs, who said they wanted more space for larger batteries. The American company developed the product in its joint customer labs across the US, China and Korea and built it on its 232-layer 3D NAND technology.
The UFS 4.0 chip has a 20% smaller footprint compared to the 11 x 13mm solution introduced last June. This will reduce power consumption without compromising overall performance. Micron introduced HPM (High-Performance Mode), a proprietary feature that optimizes performance during intensive smartphone use, with 25% improved speed when HPM is activated.
Micron is now shipping samples of the new UFS 4.0 storage in three variants – 256 GB, 512 GB, and 1 TB.
